Thermal Grizzly – Minus Pad 8 (120x20x1,0mm) 2 Pieces- Self-Adhesive Cooling Conductive Thermal Pad – Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox

Thermal Grizzly Thermal Pad Minus

EXPERT FEATURES

• THERMAL CONDUCTIVE PAD – It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
• FLEXIBLE STRUCTURE – The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
• USED IN VARIOUS SCENARIOS – It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
• GREAT RESULTS – By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
• 8W/(m·K) THERMAL CONDUCTIVITY – With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements

---

FROM THE MANUFACTURER

Thermal Grizzly minus pad 8

Thermal Grizzly’s Minus Pad series features highly elastic and flexible thermal pads with exceptional conductivity that fill even the smallest gaps between components, made from a ceramic silicon formula complex and nano aluminum oxide for optimal and constant heat transfer with minimal pressure.

Technical Details

The Thermal Grizzly Minus Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C to +250 °C. It is perfect for configurations that support extremely demanding applications. Simultaneously protects the contact surfaces and prevents the formation of microcracks.

The Thermal Grizzly Minus Pad 8 is best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. For OC in particular, it is also used for CPUs, memory modules, GPUs, graphics card memories or motherboard chipsets. In general, it can be used for any component that uses a metal case as a heat sink.

Compatibilities

• PS3, PS4, PS5
• Xbox 360, One, Series S, Series X
• CPU, GPU
• motherboard chipset
• memory modules
• Any other component that uses a metal housing as a heat sink

 

• Thermal Conductivity: 8 W/mk
• Thermal Resistance: 0.625 K/W
• Thickness: 1.0mm
• Measurement: 120mm x 20mm x 1.0mm
• Temperature Range: -100 °C to +250 °C
• Isulating: Yes

 

Minus Pad 8 is available in different sizes

 

• 30x30mm
• 120x20mm
• 100x100mm

 

with thickness options of 0.5mm, 1mm, 1.5mm, 2mm, and 3mm.

General information

 

• Thermal Grizzly Minus Pad is a thermally conductive pad with insulating properties and removable adhesive, used as a soft gap filler that requires minimal pressure, made of modified silicone with metal oxides.
• Storage: Store Thermal Grizzly minus pad 8 at room temperature in its original packaging.

 

Scope of delivery

2x minus pad 8 2x minus pad 8 – 120mm x 20mm x 1.0mm	Bag An airtight sealable and reusable package