THERMALPAD 12.8W/M.K 120*15*1.5MM High Conductivity
XCELLENT THERMAL CONDUCTIVITY – 120x15x1.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE – High temperature performance in -40 ℃ – 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EASY & CONVENIENT TO USE – Dimension 120x120x2mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
WIDELY APPLICATION – Perfectly replaces traditional heatsink compound grease paste, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules
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