From the manufacturer

About this item

• Form Factor: M. 2 2280
  

  About this item

  • AORUS Next Generation PCIe 4.0 NVMe SSD
  • Capacity : 1 TB
  • External DDR Cache Buffer: DDR4 1 GB
  • Interface : NVMe 1.3, PCI-Express 4.0 x4
  • Seq. Read speed : up to 5000 MB/s (Random Read IOPS 750K)
  • Seq. Write speed : up to 4400 MB/s (Random Write IOPS 700K)
  • Controller :Phison E16
  • NAND Flash :3D-TLC NAND Flash
  • Wear Leveling, Over-Provision Technologies
  • TRIM & S.M.A.R.T supported
• Interface: PCI-Express 4. 0 x4, NVMe 1. 3
• Total Capacity: 1000GB
• Sequential Read Speed : up to 5000 MB/s
• Sequential Write speed : up to 4400 MB/s
• System ram type: ddr_sdram

PCIe 4.0×4 Controller

PCIe 4.0×4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash.

NAND Flash Selected for High Quality and Performance Toshiba BiCS4 NAND Flash optimizes circuitry and architecture.	Xtreme Storage Performance Delivers blazing speeds: up to 5,000 MB/s for sequential read, and up to 4,400MB/s sequential write.	Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD Performance Full copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks .

Explosion model

1. Efficiency Copper Heat Spreader

2. High Conductivity Thermal Pad

3. M.2 SSD

4. High Conductivity Thermal Pad

Efficient Copper Heat Spreader Design

Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow.